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Self-Adhesive Thermal Silicone Conductive Pad 7.5W For AI Processors AI Servers Heat Dissipation

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Self-Adhesive Thermal Silicone Conductive Pad 7.5W For AI Processors AI Servers Heat Dissipation

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Brand Name : ZIITEK

Model Number : TIF700PUS

Certification : UL

Place of Origin : China

MOQ : 1000pcs

Price : Negotiation

Payment Terms : T/T

Supply Ability : 10000/day

Delivery Time : 3-5work days

Packaging Details : 1000pcs/bag

Products name : Self-Adhesive Thermal Silicone Conductive Pad 7.5W For AI Processors AI Servers Heat Dissipation

Keywords : Thermal Silicone Conductive Pads

Thermal conductivity : 7.5W/m-K

Thickness : 0.50mm~5.0mm

Construction : Ceramic filled silicone elastomer

Color : Gray

Density(g/cm³) : 3.45

Application : AI Processors AI Servers Heat Dissipation

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Self-Adhesive Thermal Silicone Conductive Pad 7.5W For AI Processors AI Servers Heat Dissipation

The TIF®700PUS is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with an exceptionally gel-like softness, achieving a low-stress perfect fit. It is suitable for addressing issues in high-precision assemblies, such as large tolerances, uneven surfaces, and the susceptibility of delicate components to mechanical damage.


Features:


> Good thermal conductive: 7.5W/mK
> Super soft and highly compliant
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance


Applications:

> Al Servers
> Semiconductor Packaging
> Low-Altitude Aircraft
> Optical Communication Products
> 5G Base Stations

> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions

Typical Properties of TIF®700PUS Series
Property Value Test method
Color Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.45 ASTM D792
Thickness Range(inch/mm)

0.020~0.030

(0.50~0.75)

0.040~0.200

(1.00~5.00)

 ASTM D374
Hardness 50 Shore 00 20 Shore 00 ASTM 2240
Continuos Use Temp -40 to 200℃ ***
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 8.0 MHz ASTM D150
Volume Resistivity ＞1.0X1012 Ohm-meter ASTM D257
Thermal conductivity(w/m-K) 7.5 ASTM D5470
7.5 ISO 22007
Fire rating V-0 UL94 (E331100)
Product Specifications​:
Standard Thickness: 0.020" (0.50 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"×16" (406 mm×406 mm)

Component Codes:
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

TheTIF®series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.
Self-Adhesive Thermal Silicone Conductive Pad 7.5W For AI Processors AI Servers Heat Dissipation

Company Profile

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

Our services

Online-service : 12 hours , Inquiry reply within fastest.


Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.


Product Tags:

Self-adhesive thermal silicone pad

      

Conductive pad for AI processors

      

7.5W heat dissipation pad

      
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Self-Adhesive Thermal Silicone Conductive Pad 7.5W For AI Processors AI Servers Heat Dissipation Images

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